Cleaning Engineering     半導體光電產業設備機台用之零組件 --- O-Ring，Quartz，Ceramic，Anodized，Metal …等材質洗淨工程. 一般洗淨：化洗，除膜，振盪，烘乾，包裝，運送處理. 除 膜：乾式噴砂，酸洗處理， 鹼洗處理，乾式噴洗(CO2 Blasting) . 清 洗：超音波振盪，純水洗淨，超純水振盪. 表面處理：表面粗糙度，平坦度, 拋光， 研磨處理. 特殊表面加工：鋁，鈦，陶瓷熔射(Y2O3、Al2O3 Thermal Spray).陽極膜去除，再生處理 (Hard Anodize Coating) .

Cleaning Ability     Semi-conductor Industrial：300mm Parts Kits, 90 / 65 Nano process mass production. Etch tool parts kits Thin Film tool parts kits Photo tool parts kits   Optical-Electrical Industrial ：LCD、CF、OLED G5 Parts Kits, G6 planning. CVD tool parts kits：Diffuser, Backing Plate PVD tool parts kits：Masker Etch tool parts kits：Upper/Lower Electrode, Shield Sputter tool parts kits：ULVAC & AFC Parts Kits